| Items |
Specification |
Maximum Layer Count |
12 Layers |
| Finished Board Thickness |
16mil ~ 128mil (0.4mm ~3.2mm) |
| Maximum Dimension |
20" x 24" (508mm x 610mm) |
| Minimum Line Width / Spacing |
4mil / 4mil (0.1mm / 0.1mm) |
| Minimum Mechanical Hole Diameter |
10mil (0.25mm) |
| Minimum Laser Hole Diameter |
4mil (0.1mm) |
| Minimum Solder PAD Diameter |
10mil (0.25mm) |
| Hole Position Presision |
2mil (0.05mm) |
| Minimum Hole to Hole Spacing |
12mil (0.3mm) |
| Minimum Hole to Edge Spacing |
8mil (0.2mm) |
| Surface Treatment |
HAL, Lead Free HAL, Flash Gold, ENIG, OSP, Imm. Siliver, Imm. Tin |
| Minimum Hole Wall Thickness |
>18um |
| Maximum Aspect Ratio |
8.0 : 1 |
| Minimum Annular Ring |
4.5mil (0.115mm) |
| Maximum Thickness of Wiring |
Inner Layer: 3oz, Outer Layer:4oz |
| Minimum Height of Characters |
32mil (0.8mm) |
| Minimum Size of Punched Hole |
0.1" (2.5mm) |
| Controlled Impedance |
+/- 10% |
| Outline Precision (CNC) |
4mil (0.1mm) |
| Outline Precision (Punch) |
2mil (0.05mm) |
| HDI Construction |
BVH/ Build up/ 1+N+1/ 2+N+2 |
